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ISL55110, ISL55111
Package Outline Drawing
M8.173
8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 01/10
A
2
4
3.0 ±0.5
6.40
4.40 ±0.10
3
4
CL
PIN 1
8
5
SEE DETAIL "X"
0.20 C BA
ID MARK
1
4
0.65
B
0.09-0.20
H
TOP VIEW
0.05
END VIEW
1.00 REF
C
0.90 +0.15/-0.10
SEATING
PLANE
0.25 +0.05/-0.06
1.20 MAX
6
GAUGE
PLANE
0.25
0.10 C
0.10
CBA
0.05 MIN
0°-8°
SIDE VIEW
0.15 MAX
DETAIL "X"
0.60 ±0.15
(1.45)
(5.65)
PACKAGE BODY
OUTLINE
(0.35 TYP)
(0.65 TYP)
TYPICAL RECOMMENDED LAND PATTERN
18
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimension does not include mold flash, protrusions or
gate burrs. Mold flash, protrusions or gate burrs shall
not exceed 0.15 per side.
3. Dimension does not include interlead flash or protrusion.
Interlead flash or protrusion shall not exceed 0.15 per side.
4. Dimensions are measured at datum plane H.
5. Dimensioning and tolerancing per ASME Y14.5M-1994.
6. Dimension on lead width does not include dambar protrusion.
Allowable protrusion shall be 0.08 mm total in excess of
dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm.
7. Conforms to JEDEC MO-153, variation AC. Issue E
FN6228.6
August 8, 2013
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